AGFB023R24C2E2V System On Chip (SoC)_ Standard International_Supplier electronic component distributor

Part number：

Product classification：

Manufacturer：

Type：

Encapsulation：

Packing：

Quantity：

RoHS status：

AGFB023R24C2E2V

System On Chip (SoC)

Tray

Price:

$17,658.9540

Total number

Quantity

Price

Total price

$17,658.9540

$52,976.8620

Obtain quotation information

product details

AGFB023R24C2E2V

Part number：

Product classification：

Manufacturer：

Type：

Encapsulation：

Packing：

Quantity：

RoHS status：

Specification sheet：

AGFB023R24C2E2V

System On Chip (SoC)

System On Chip (SoC)

Tray

Product parameters

TYPE	DESCRIPTION
Mfr	Intel
Series	Agilex F
Package	Tray
Product Status	ACTIVE
Package / Case	2340-BFBGA Exposed Pad
Speed	1.4GHz
RAM Size	256KB
Number of I/O	480
Operating Temperature	0°C ~ 100°C (TJ)
Core Processor	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes	FPGA - 2.3M Logic Elements
Connectivity	EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals	DMA, WDT
Supplier Device Package	2340-BGA (45x42)
Architecture	MPU, FPGA