Intersil (Renesas Electronics Corporation)
Effective January 1, 2018, Renesas and Intersil will operate as one unified enterprise, bringing about a significant expansion to the intrinsic capabilities of semiconductors. This combination unites the widely acclaimed Renesas MCU and SoC technologies with Intersil’s market-leading expertise in high performance power management and precision analog devices. In turn, this brings organic growth in the automotive, industrial and broad-based sectors, allowing the new enterprise to respond with greater speed to customers’ systems needs.
The union of Renesas with Intersil began with the completion of the acquisition on February 24, 2017, and the unified “One Global Renesas” went into operation across all markets the following July — bringing together the strengths of both organizations in anticipation of customer requirements in a rapidly changing market environment. This truly global organization offers a vast synergistic effect.
Join Renesas as it strengthens its leading position in the global semiconductor market.
Effective January 1, 2018, Renesas and Intersil will operate as one unified enterprise, bringing about a significant expansion to the intrinsic capabilities of semiconductors. This combination unites the widely acclaimed Renesas MCU and SoC technologies with Intersil’s market-leading expertise in high performance power management and precision analog devices. In turn, this brings organic growth in the automotive, industrial and broad-based sectors, allowing the new enterprise to respond with greater speed to customers’ systems needs.
The union of Renesas with Intersil began with the completion of the acquisition on February 24, 2017, and the unified “One Global Renesas” went into operation across all markets the following July — bringing together the strengths of both organizations in anticipation of customer requirements in a rapidly changing market environment. This truly global organization offers a vast synergistic effect.
Join Renesas as it strengthens its leading position in the global semiconductor market.
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IC CLK BUFFER 1:4 HCSL 20-TSSOP
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VFQFPN 7.00X7.00X0.90 MM, 0.50MM
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9DBL0951B 9 O/P PCIE G1-2-3 FANO
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